Molex Busbars are engineered to address demanding thermal, mechanical, and integration challenges, enabling design teams to optimize space, enhance system robustness, accelerate time-to-market, and confidently meet evolving industry standards across diverse applications. 

Backed by decades of design and manufacturing expertise, regional engineering support, and a global production network,

"Direct-to-chip cooling has become the standard for computing, but to truly scale AI, we must also address thermal management challenges along the power delivery path,.By adopting Molex’s new multi-channel liquid-cooled busbars, liquid cooling technology is integrated into the power distribution backbone.."

The solution currently supports currents up to 15,000A, with a strategic roadmap to support 25,000A in the future.

Rack-level power distribution is increasingly constrained by thermal challenges, as air-based cooling systems struggle to remove the growing heat loads generated by high-density, power-delivery components, leading to hot spots and reduced thermal stability

These busbars enable high continuous current ratings, making them ideal for data center power distribution, AI and graphics processing unit (GPU) servers.

Our Molex and Kunshan plant have been producing busbar for over 50 years, providing us with the knowledge for quality power delivery solution. We combine this expertise with Molex's broad portfolio of capabilitie to provide customer with integrated connector busbar solution from a single supplier. 

For example, Molex's Coeur CST high current interconnect system is one of the connector we can integrate into copper bar. Coeur CST connector feature a low profile, low voltage drop and floating system for easier assembly. Combining this innovative connector system with our busbar provide an efficient power delivery solution. For a more complete solution, we can manufacture bus bar that become part of a Molex PCB assembly or battery management system. 

EXTreme Ten60 Power
Hybrid power and signal solution designed for board-to-board, wire-to-board and panel-to-board application, delivering up to 260.0A per linear inch, fast response time and easy-to-configure module. 

One-touch connector feature one-step mating, an automatic pinning mechanism and high retention force for reliable connection and easy operation. This serie of connector offer a visible release button for easy FFC/FPC cable release operation and a locking pin system that ensure high retention force connection of the FFC/FPC cable. Easy-On FFC/FPC connector have an insulation resistance of 50MΩ, a dielectric withstand voltage of 125VA, and can operate at temperature up to 125°C. These connector are ideal for connected mobility, automotive IoT infotainment, assembly automation, PCB server, smart appliances and LED (OLED) displays. 

The Volfinity Battery Contact System provide a reliable and easy-to-implement interface solution for connecting batterie to control boards in EV battery module, eliminating the need for daisy-chaining wires. Product manufacturer using battery management system will find that, as a leading connector manufacturer, Molex is the best one-stop partner for reliable interconnection.